Rogers Corporation

http://www.rogerscorp.com

Jun 17, 2021

curamik Metallized Ceramic Substrates

Rogers curamik® product suite offers best-in-class metallized ceramic substrates that enable higher power efficiency. Our curamik® substrates consist of pure copper bonded or brazed to a ceramic substrate and are designed to carry higher currents, provide higher voltage isolation and operate over a wide temperature range.

Our curamik Ceramic substrates offer high heat conductivity, high heat capacity and thermal spreading of the substrates' thick copper cladding, making our substrates indispensable to power electronics. The low coefficient of thermal expansion of the ceramic substrate means they outperform substrates based on metal or plastic.

Benefits:

Great heat conductivity and temperature resistance
High insulation voltage
High heat spreading
Low coefficient of thermal expansion outperforms metal or plastic substrates
Adjusted expansion coefficient enables chip on board
Efficient processing of master cards and single pieces
Range of formulations optimized for various power applications