ICT SUEDWERK GmbH

Jul 18, 2025

Thermal Interface Materials

As a total supplier for heat-conducting products, ICT SUEDWERK offers thermal solutions for power semiconductors and active components.

Despite enormous development progress, electronic components are releasing a considerable amount of heat loss in the current application. If this heat energy is not immediately dissipated without appropriate measures, this could lead to the inevitable destruction of the component and thus to the failure of the whole application.

For dissipation of thermal dissipation, heat sinks such as housing, cooling plates or heatsinks are usually used and are mounted in conjunction with the so-called TIM´ s on the electronic component. However, the surfaces of these heat sinks are generally not plan or smooth, so that no sufficient thermal path can be produced without further mechanical processing of the surfaces to be contacted (milling, grinding, polishing etc.). Due to the technical overhead of surface machining, the better economical solution is to produce the ideal thermal contact by means of heat-conducting interface materials - especially heat conducting films.

These thermal interface materials, if necessary, also ensure the electrical insulation of the components to the heat sink.

As a total supplier for heat-conducting products, ICT SUEDWERK offers thermal solutions for power semiconductors and active components.

High-quality processing is combined with excellent thermal properties and electrical performance of well-known manufacturers of thermal interface materials and unifies innovative, integrated solutions for heat management and insulation technology.

All the products:

01 Thermally Conductive Silicone-Free PSA Films

Acrylate-based, unreinforced/reinforced

02 Silicone caps, tapes and tubes

ICT thermally conductive so-called "box-shaped" caps, tapes and tubes for many common transistor types. The heat conducting caps, tapes and tubes are made on the basis of noncombustible silicone rubber and heat-conducting ceramic formulated materials. The product groups dispose a very high electrically insulation properties and very good thermal conductivity up to 2 W / mK).

03 Foils, Films, Fibreglass Polyimide (reinforced)

Thermally Conductive Foils, Films, Fibreglass Polyimide (reinforced)

04 Thermally Conductive Gap Fillers, Pads, Spacers, Soft-, Ultrasoft-Gel

Electrically insulating soft and ultra-soft silicone-based, highly heat-conductive Gapfiller so called Spacer are ideal for applications in which, in addition to thermal conductivity, the compensation of extreme tolerances and gaps is particularly important, especially in non-planar structures without the application of pressure, and electrical insulation.

05 Gapfiller, Pads, Spacer, Soft- Ultra-Soft-Gel Silicone-free

Silicone-free

06 Thermally Conductive Phase-Change Materials

Silicone-Free, Anisotropic, High-Performance Interface Materials

07 Thermally conductive graphite foils, synthetic pyrolitic graphene films

Thermally conductive graphite foils, synthetic pyrolitic graphene films. Silicone-free, anisotropic, high-performance interface material

08 Technical Ceramics

Heat-conducting technical ceramics ICT-TCC-ALO-96 and 99 (oxide ceramic-alumina) and ICT-TCC-ALN-200 (aluminium nitride-ceramics). The excellent thermal properties-combined with mechanical stability and high electrical insulation-are the driving force for the use of ceramic materials wherever an improved thermal conductivity is required.