ICT SUEDWERK GmbH

Maximum performance combined with high packing density (leading to minimal space) automatically leads electric components to develope high temperatures. To protect the components, the use of the TIM that matches the needs of the application the most, has to be used because the heat released in the process must be reliably dissipated. At this point the ICT-Südwerk comes into play: with our high performance suppliers in matters of aluminiumnitrid ceramic we can supply the ICT-TCC-ALN-200; a product with outstanding isolating characteristics and a very high thermal conductivity (≥ 180 W/mK).

Ceramic discs are typically used from 0,5 to 2,0mm or more thicker depending on the user specification.

Despite the high thermal conductivity there is a general problem. For optimum connection of the power component to the heat sink, either a metallization is required or a TIM in the form of heat conducting paste or heat conducting adhesive. Because the optimal thermal path, i.e. the heat transfer, is only guaranteed if the thermal barriers are reduced.

Our Tipp: Use pure phase-change materials without substrate carriers.

ICT product variants that are ideally suited for this case:

• ICT-Xp45-4W-14R | series

or the TC-Fill-up-STICK  product variants

• ICT-BAR-In- (oder Ac) -19G / 001 oder
• ICT-PEN-In- (oder Ac) -19G / 001

Other features:

• Very good electrical insulation (15kV/mm)
• Medium to extremely high mechanical strength (300 to 630 MPa)
• Very high compressive strength (2000 to 4000 MPa)
• Very high hardness
• High thermal conductivity (up to 180 W/mK)
• Specific Heat J/kg • k = 738 ± 20
• High corrosion and wear resistance
• Good gliding properties
• Low Density (3.30 | 3.35 g/cm³
• Operating temperature without mechanical load 1000 to 1500 °c

Applications:

• All dimensions available for standard semiconductor enclosure
• In dimensions according to customer specification
• Also available in plate dimensions: 115 x 115/ 165 x 115/ 190 x 138 mm
• Thickness: 0,50 - 2.0 mm (+/- 10%)
• Additional material thickness can be requested

More Information here