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:quality(80)/p7i.vogel.de/wcms/10/78/107856328ef320cc081bf88e0baf95e8/0128685487v2.jpeg "Integrated magnetics enable compact and reliable power conversion for space systems. (Source: Exxelia)")
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:quality(80)/p7i.vogel.de/wcms/2f/93/2f9364112e8c6ff38c26f9ba34d0f692/0128791306v2.jpeg "Scalable, high-performance SiC MOSFET solutions enable faster development and improved efficiency in power electronics. (Symbolic image) (Source: © metamorworks - stock.adobe.com)")
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TRADE FAIR NEWS Heraeus Electronics to Debut New Die Top System Material with Insightful Live Presentations at PCIM Expo 2025
Sponsored by
:fill(fff,0)/p7i.vogel.de/companies/68/08/6808a2b3b6595/het-logo.jpeg "het-logo (Heraeus Electronics)"){kind=logo}
Heraeus Electronics will highlight its latest advancements in high-reliability materials for power electronics through a series of live presentations at PCIM Expo 2025, scheduled to take place May 6-8, 2025 in Nuremberg, Germany. Visitors can explore Heraeus Electronics' wide range of material solutions at Hall 6, Booth 6-310.
Among the highlights at PCIM will be the debut of DTS® Silver, a next-generation Die Top System material designed for high-performance applications at an optimized cost. The Heraeus Die Top System (DTS®) enables copper wire on sintered power semiconductors, delivering exceptional flexibility. DTS® enhances electrical and thermal conductivity, strengthens die connection reliability, and optimizes overall module performance. The innovative solution DTS® Silver is free of palladium and gold, offering a cost-efficient yet highly reliable alternative for power electronics manufacturers.
Heraeus Electronics will also showcase Condura®.ultra, a silver-free AMB bonding technology for metal-ceramic substrates. Designed for high-end applications and with a low total cost of ownership Condura®.ultra maintains outstanding reliability. Condura®.ultra enables the use of thicker copper layers while allowing thinner ceramics, maintaining equal thermal resistance compared to traditional AlN substrates. With high thermal conductivity (>80 W/m∙K), this innovative material is ideal for sintering, bonding, and soldering processes, offering exceptional performance.
Experts from Heraeus will deliver two insightful presentations at the e-Mobility & Energy Storage Stage (Hall 6, Booth 220), providing in-depth insights into cutting-edge materials for power electronics:
- “Heraeus Electronics Introduces the Next Generation DTS®”
Speaker: Christian Kersting
Date & Time: May 6, 12:30 PM
- “Ag-Free Silicon Nitride AMB Substrates for Automotive Power Module Applications”
Speaker: Oliver Mathieu
Date & Time: May 7, 12:55 PM
Heraeus Electronics will also host several live product presentations at its booth, showcasing the latest advancements in power electronics materials:
DTS® Silver – The innovative solution for cost-optimized, high-performance applications
Live Presentation: May 7th, 14:00 PM and May 8th, 11:00 AM
Condura®.ultra – A cost-effective, silver-free Silicon Nitride AMB for demanding applications
Live Presentation: May 6th, 11:00 AM and May 8th, 13:00 PM
mAgic PE360 – Pressure silver sinter paste for module attach applications
Live Presentation: May 6th, 14:00 PM
Fastlane – An EU-funded project accelerating the European value chain for power electronics
Live Presentation: May 7th, 11:00 AM
Heraeus Electronics invites attendees to visit Hall 6, Booth 6-310 to experience these solutions and more firsthand and engage with technical experts.
(ID:50398538)
:quality(80)/p7i.vogel.de/wcms/b7/ae/b7aef5b0ab72c24edd51f8318d4029c4/0127137768v2.jpeg "From raw materials to system demonstrators: FastLane strengthens Europe’s technological sovereignty. (Source: © Adobe Stocks, modified by Heraeus Electronics
)")
:quality(80)/p7i.vogel.de/wcms/15/ff/15fffd51fda2c3072ed63ac88ad4b162/0124223103v2.jpeg "The \"Dauerpower\" inverter redefines electric vehicle powertrains with a compact design, offering 600 kW constant output and 98.7 % peak efficiency using advanced silicon carbide technology. (Source: Fraunhofer IZM, Volker Mai)")