Heraeus Electronics GmbH & Co. KG

Microbond® Solder Preforms are engineered to meet the mechanical, thermal, and reliability requirements of modern power module assembly. Designed for secure attachment of power packages to baseplates or coolers, they utilize advanced Innolot alloys to ensure consistent performance — even under harsh thermal cycling and high-power conditions. Their clean and easy process without paste printing simplifies production, reduces material waste to a minimum, and supports high-throughput manufacturing.

With flexible sizing and form factors, Microbond® Solder Preforms are compatible with the majority of module and substrate interconnect applications in the market. As a balanced solution between cost and performance, they offer durable and efficient bonding for a wide range of power electronics assemblies.

Please find out more about this product here - Solder Preforms