:quality(80)/p7i.vogel.de/wcms/2f/f3/2ff3221bf7665de2d0acf83760bfd1fa/0130031523v2.jpeg "Wolfspeed presents a 300 mm silicon carbide technology platform designed to support advanced packaging and high-efficiency power delivery for AI data center infrastructure. (Source: Wolfspeed)")
:quality(80)/p7i.vogel.de/wcms/c3/16/c316e955a97f5d72d9678297b237b9e5/0129932858v2.jpeg "Left: the single-phase version of the SENTRON ECPD with RCM, right: a model of the future three-phase version of the SENTRON ECPD. (Source: Siemens)")
:quality(80)/p7i.vogel.de/wcms/ef/0a/ef0adb0acf793fe147cc27c21f6a7a67/0129954238v2.jpeg "Empower Semiconductor introduces embedded silicon capacitors designed to improve power delivery and stability in AI and high-performance computing processors. (symbolic image) (Source: © IF.arc - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/53/f9/53f9301dfc9292d02960f7996c79cc6e/0129927601v2.jpeg "Wolfspeed’s new 10 kV SiC MOSFET enables high-voltage power conversion for grid and industrial applications. (symbolic image) (Source: © ＣＲＥＡＴＩＶＥ- 3.4 - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/6e/cd/6ecd41d095d5111cf4ed37b714844487/0129930878v2.jpeg "PCIM Asia Shenzhen provides a platform for industry experts to present new developments in power electronics and electrification technologies. (symbolic image) (Source: © killykoon - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/02/c0/02c0e9722f70b1134dbf96fb59a9c73d/0129655179v2.jpeg "The PCIM Conference 2026 will take place from June 9-11, featuring discussions on power electronics trends, including GaN technology and AI applications. (symbolic image) (Source: © Elmira - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/cc/67/cc670ea2029cd2af5c641af70e1bf734/0129816392v4.jpeg "Fraunhofer IAF coordinates the EU SUPREME project to accelerate GaN and SiC power semiconductor innovation in Europe. (Source: Fraunhofer IAF)")
:quality(80)/p7i.vogel.de/wcms/ea/e6/eae6aee30071e67a5627027974437134/0129544613v2.jpeg "GlobalFoundries and Renesas strengthen their collaboration to support U.S.-based semiconductor production and supply chain resilience. (Source: © ronstik - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/b1/5e/b15ee02b0ba02db70cf61e37d66ad1d3/0129349127v2.jpeg "Vehicle-to-grid (V2G) chargers enable bidirectional energy flow, allowing electric vehicles to act as mobile energy storage systems that can both draw power from and feed power back into the grid. (Source: © medienvirus - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/26/d5/26d591cc340077026eac56a0e7564faf/0129949603v2.jpeg "Flexible: The solid silicone-based electrolyte is elastic, thereby compensating for the voids that form in solid-state batteries during charging and discharging. (Source: Empa)")
:quality(80)/p7i.vogel.de/wcms/4d/e0/4de02f76a37cbb3df30dd231de589c8e/0128866890v2.jpeg "Both legacy and vGaN show higher carrier mobility and band gap energies compared to other power semiconductors. (Source: © phonlamaiphoto - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/18/0b/180b7b63afc91e523592d8a5ce161c96/0129847487v2.jpeg "InGaAs-based photodetectors enable sensitive and fast detection in the short-wave infrared spectrum for modern sensing and communication applications. (Source: © VITALII - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/be/c8/bec8d43fc0ee73414274be44608b2970/0129748903v2.jpeg "The Infiniium XR804KA real-time oscilloscope delivers faster response time, improved stability, and streamlined workflows for high-speed digital and compliance testing. (Source: Keysight)")
:quality(80)/p7i.vogel.de/wcms/23/ee/23ee4a97790d6009dbfd7d9577ffa723/0129220424v2.jpeg "The R&S FPL1044 with the new RTSA option makes 40 MHz real-time frequency analysis available up to 44 GHz. (Source: Rohde & Schwarz )")
:quality(80)/p7i.vogel.de/wcms/3c/d1/3cd1cacbceb792ba63727199c61ca434/0127801860v2.jpeg "Thanks to cloud technology, users can collaborate on projects from anywhere and always have access to the latest planning data. (Source: SIEMENS)")
:quality(80)/p7i.vogel.de/wcms/5a/a0/5aa0436498af618297961fd54ab36cdf/0126290792v2.jpeg "Siemens accelerates student-led semiconductor innovation across Europe’s leading technical universities through Cre8Ventures’ Open Higher Education Program developed in collaboration with Arm and University of Southampton (Source: Siemens Digital Industries Software)")
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Apr 23, 2025
Solder Pastes
Heraeus Electronics provides an extensive selection of solder pastes, including no-clean and water-soluble variants, spanning from type 3 to type 8 and beyond.
Our alloy offerings encompass SAC305, ULA SAC305, high-reliability alloys, and low-temperature alloys. Additionally, we offer alloy options with 100% recycled tin, contributing to significant carbon footprint reduction.
We offer solder pastes for the following applications:
· Surface Mount Technology (SMT)
· Power Electronic Module Die Attach
· Die Attach for Power Discrete
· Advanced Packaging
· Mini LED
For more information: https://www.heraeus-electronics.com/en/products-and-solutions/solder-materials/solder-pastes/
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