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Heraeus Electronics GmbH & Co. KG

https://www.heraeus-electronics.com/en/

Apr 23, 2025

Sinter Pastes

The Heraeus Electronics mAgic® series sinter materials are designed for power applications on substrates, baseplates, or heatsinks (pressure sintering), as well as for lead frame packages (non-pressure sintering).

Silver sintering technology is ideal for high operating temperatures due to its pure silver (Ag) die attach layer. These silver sintered pastes provide a robust, lead-free alternative to traditional solder pastes, significantly extending device lifespan up to 10 times while maintaining excellent thermal conductivity.

We offer sinter pastes for die attach and module attach.

For more information: https://www.heraeus-electronics.com/en/products-and-solutions/sinter-materials/sinter-materials-overview/