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Heraeus Electronics GmbH & Co. KG

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Mar 10, 2026

Emphasizing Module Attach Material Options at APEX 2026

Heraeus Electronics will exhibit at the 2026 APEX EXPO at the Anaheim Convention Center, Booth 1730, where the company will showcase a broad portfolio of assembly materials focused on power module and advanced electronics applications.

At this year’s show, Heraeus Electronics will display a wide range of soldering, sintering, and preform solutions, emphasizing material choices that allow manufacturers to balance performance, reliability, and cost. Products on display will include Microbond® SMT660 Innolot®, SMT650 SAC305, mAgic® PE338 die-attach materials, mAgic®PE360 sintering paste, and Microbond® solder preforms.

A key theme of the Heraeus Electronics exhibit will be module attach, with side-by-side material options for different product priorities. For applications requiring the highest thermal and mechanical performance, Heraeus will highlight large-area silver sintering using mAgic® PE360. For manufacturers seeking a lower-cost alternative while maintaining strong reliability, Heraeus will feature its Microbond® solder preforms based on Innolot® and Innolot® 2.0 alloys.

Check it out here: Heraeus Electronics to Highlight Module Attach Material Options at APEX 2026