Mobile-Menu
het-logo (Heraeus Electronics)

Heraeus Electronics GmbH & Co. KG

https://www.heraeus-electronics.com/en/
back

Feb 10, 2026

Cutting-Edge Packaging Insights at CIPS 2026

Heraeus Electronics will deliver three technical presentations and host a tabletop exhibit, showcasing its latest advances in power electronics packaging materials and technologies at CIPS Conference & Exhibition in Dresden. CIPS (International Conference on Integrated Power Electronic Systems) is one of the most important international forums for power electronics. With a strong technical program and high international participation, the conference places special emphasis on packaging innovations.

Heraeus Electronics Presentations Include:

  1. A New Approach Towards Cost-Effective Sintering – Microstructural Investigations of Aged SiC Power Modules
  2. Sintering-Induced Fracture in WBG Dies Based on Substrate Choice
  3. Electrical Lifetime Prediction of Various Si₃N₄ Ceramic Substrates for Power Modules


We will also exhibit at a tabletop in the exhibition area, where attendees can talk to experts and learn more about the company’s solutions for module packaging, e.g. sintering and bonding materials, and substrate technologies.

Check it out here: Heraeus Electronics Presentations at CIPS 2026