:quality(80)/p7i.vogel.de/wcms/2f/f3/2ff3221bf7665de2d0acf83760bfd1fa/0130031523v2.jpeg "Wolfspeed presents a 300 mm silicon carbide technology platform designed to support advanced packaging and high-efficiency power delivery for AI data center infrastructure. (Source: Wolfspeed)")
:quality(80)/p7i.vogel.de/wcms/c3/16/c316e955a97f5d72d9678297b237b9e5/0129932858v2.jpeg "Left: the single-phase version of the SENTRON ECPD with RCM, right: a model of the future three-phase version of the SENTRON ECPD. (Source: Siemens)")
:quality(80)/p7i.vogel.de/wcms/ef/0a/ef0adb0acf793fe147cc27c21f6a7a67/0129954238v2.jpeg "Empower Semiconductor introduces embedded silicon capacitors designed to improve power delivery and stability in AI and high-performance computing processors. (symbolic image) (Source: © IF.arc - stock.adobe.com)")
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:quality(80)/p7i.vogel.de/wcms/6e/cd/6ecd41d095d5111cf4ed37b714844487/0129930878v2.jpeg "PCIM Asia Shenzhen provides a platform for industry experts to present new developments in power electronics and electrification technologies. (symbolic image) (Source: © killykoon - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/02/c0/02c0e9722f70b1134dbf96fb59a9c73d/0129655179v2.jpeg "The PCIM Conference 2026 will take place from June 9-11, featuring discussions on power electronics trends, including GaN technology and AI applications. (symbolic image) (Source: © Elmira - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/cc/67/cc670ea2029cd2af5c641af70e1bf734/0129816392v4.jpeg "Fraunhofer IAF coordinates the EU SUPREME project to accelerate GaN and SiC power semiconductor innovation in Europe. (Source: Fraunhofer IAF)")
:quality(80)/p7i.vogel.de/wcms/ea/e6/eae6aee30071e67a5627027974437134/0129544613v2.jpeg "GlobalFoundries and Renesas strengthen their collaboration to support U.S.-based semiconductor production and supply chain resilience. (Source: © ronstik - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/b1/5e/b15ee02b0ba02db70cf61e37d66ad1d3/0129349127v2.jpeg "Vehicle-to-grid (V2G) chargers enable bidirectional energy flow, allowing electric vehicles to act as mobile energy storage systems that can both draw power from and feed power back into the grid. (Source: © medienvirus - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/26/d5/26d591cc340077026eac56a0e7564faf/0129949603v2.jpeg "Flexible: The solid silicone-based electrolyte is elastic, thereby compensating for the voids that form in solid-state batteries during charging and discharging. (Source: Empa)")
:quality(80)/p7i.vogel.de/wcms/4d/e0/4de02f76a37cbb3df30dd231de589c8e/0128866890v2.jpeg "Both legacy and vGaN show higher carrier mobility and band gap energies compared to other power semiconductors. (Source: © phonlamaiphoto - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/18/0b/180b7b63afc91e523592d8a5ce161c96/0129847487v2.jpeg "InGaAs-based photodetectors enable sensitive and fast detection in the short-wave infrared spectrum for modern sensing and communication applications. (Source: © VITALII - stock.adobe.com)")
:quality(80)/p7i.vogel.de/wcms/be/c8/bec8d43fc0ee73414274be44608b2970/0129748903v2.jpeg "The Infiniium XR804KA real-time oscilloscope delivers faster response time, improved stability, and streamlined workflows for high-speed digital and compliance testing. (Source: Keysight)")
:quality(80)/p7i.vogel.de/wcms/23/ee/23ee4a97790d6009dbfd7d9577ffa723/0129220424v2.jpeg "The R&S FPL1044 with the new RTSA option makes 40 MHz real-time frequency analysis available up to 44 GHz. (Source: Rohde & Schwarz )")
:quality(80)/p7i.vogel.de/wcms/3c/d1/3cd1cacbceb792ba63727199c61ca434/0127801860v2.jpeg "Thanks to cloud technology, users can collaborate on projects from anywhere and always have access to the latest planning data. (Source: SIEMENS)")
:quality(80)/p7i.vogel.de/wcms/5a/a0/5aa0436498af618297961fd54ab36cdf/0126290792v2.jpeg "Siemens accelerates student-led semiconductor innovation across Europe’s leading technical universities through Cre8Ventures’ Open Higher Education Program developed in collaboration with Arm and University of Southampton (Source: Siemens Digital Industries Software)")
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Dec 16, 2025
Heraeus Electronics Whitepaper: Advancements in Flexible End Terminations for High-Reliability Passive Components in Electrified Vehicles
In our technical whitepaper we dive into innovative flexible end termination technology for high-reliability passive components such as MLCCs in Electric Vehicles.
Electrification is transforming the automotive industry, creating an urgent need for high-reliability passive components such as multilayer ceramic capacitors (MLCCs). Electric vehicles (EVs) require nearly 10x more MLCCs than ICE vehicles, making durability, cost efficiency, and simplified processing essential.
Our latest research paper introduces a groundbreaking flexible end termination ink, ET2010 —a next-generation solution engineered to surpass the limitations of conventional epoxy systems. This innovative material delivers superior flexural strength, room-temperature stability, and electrical performance, while reducing silver content for improved sustainability and cost control. ET2010 sets a new standard for surface-mount passive components in demanding EV applications, supporting the future of automotive electrification.
Download it here: Heraeus Electronics Whitepaper I Advancements in Flexible End Terminations for High-Reliability Passive Components in Electrified Vehicles
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