Littelfuse, Inc. has announced the launch of the Littelfuse/C&K TDB Series, an ultra-miniature, half-pitch surface-mount DIP switch family engineered to support high-density PCB designs where space, reliability, and manufacturability are critical.

Infineon Technologies AG and DG Matrix are partnering to enhance the efficiency of power conversion required to connect AI data centers and industrial power applications to the public grid. As part of the collaboration, DG Matrix will source latest-generation silicon carbide (SiC) technology from Infineon for use in its Interport multi-port solid-state transformer platform. This strengthens DG Matrix's semiconductor supply chain and enhances the efficiency, power density, and reliability of its SST systems, which are deployed worldwide.

Bourns has announced the SRP2008DP Series, its new line of high current shielded power inductors designed for high current applications that need to push the limits of board-space efficiency. Constructed with a metal-alloy powder core and packaged in a low-profile 0.8 mm footprint, the SRP2008DP Series delivers the saturation current capacity that power dense DC-DC converter designs demand—without the design layout penalties that typically accompany such performance.

Power Integrations has introduced a breakthrough in flyback topology extending the power range of flyback converters to 440 W—well beyond the limits that traditionally required more complex resonant and LLC topologies. The new TOPSwitchGaN flyback IC family unites the company’s groundbreaking PowiGaN technology with its iconic TOPSwitch IC architecture, reducing complexity, eliminating heat sinks in many cases, shortening design time, improving manufacturability, and lowering total system cost.

Analog Devices, Inc. announced the opening of its new advanced manufacturing facility in Thailand, further strengthening its advanced manufacturing and test capacity while expanding resilient, sustainable semiconductor production in the Asia-Pacific region. The expansion builds on ADI’s hybrid manufacturing strategy, which leverages a global network of internal factories and external foundry/Outsourced Semiconductor Assembly and Test (OSAT) partners to deliver resilient, high‑performance solutions.

From 9 to 11 June 2026, the leading international exhibition and conference for power electronics, the PCIM Expo & Conference, returns to Nuremberg, Germany. With over 650 exhibitors and a record-breaking 500+ presentations, this hub for the power electronics industry will offer a comprehensive program for trade visitors. With the new AI & Data Centers Stage, this year’s trade fair and conference program will focus on the topic of artificial intelligence and data centers for the first time.

Vicor Corporation announced that the BCM6135 DC-DC bidirectional power converter module won the 2026 Electronics Excellence Award in the power category sponsored by Electronic Specifier. The annual award celebrates the most innovative and impactful achievements across the electronics sector.

After three years of intensive collaboration, the European ICOS project has presented its final recommendations for strengthening the semiconductor industry in Europe. The report shows how international cooperation, targeted technological priorities and strategic partnerships can help translate Europe's research strength into industrial leadership and sustainably strengthen its role in the global semiconductor value chain.

This work presents a highly-integrated GaN-based monolithic bidirectional switch (MBDS) with blocking voltage beyond 1200 V.

This paper presents a highly integrated high power density design of a motor drive, utilizing integrated GaN power stages as well as novel current sensing ICs.

This paper aims to promote the integration of DC Semiconductor Circuit Breakers (SCCBs) into existing DC networks by ensuring reliability through accurate Remaining Useful Life (RUL) predictions.

This paper proposes a new gate driver that always achieves the fastest switching while keeping the surge voltage below the breakdown voltage.

The industry needs power semiconductor devices with higher power densities and electron mobilities. Both are achievable with the help of a wide band gap and various other properties. It makes so many compounds suitable to become the next standard in the industry. Silicon carbide (SiC) and gallium nitride (GaN) replaced silicon in many power applications.

A 170 kW edge data center located inside an Alaskan hydroelectric plant is a small example of a much larger shift toward self-powered compute infrastructure. The Cordova Electric Cooperative and San Francisco-based Greensparc have deployed a 170-kilowatt edge data center inside the Humpback Creek hydroelectric facility in Cordova, Alaska, co-locating GPU compute directly with surplus renewable generation on a U.S. Department of Energy-supported microgrid.

ROHM has released reference designs "REF68005", "REF68006", and "REF68004" for three-phase inverter circuits featuring EcoSiCTM brand SiC molded modules "HSDIP20", "DOT-247", and "TRCDRIVE packTM" on ROHM’s website. Designers can use the data provided in these reference designs to create the drive circuit boards. When combined with ROHM's SiC modules, these designs help reduce the person-hours required for device evaluation.

The Solid State Transformer (SST) has been gaining tremendous attention, both in academia and industry, promising extraordinary (often hyped) power conversion performances, well beyond the current state of the art converters. Despite well-evidenced efforts, SST as a technology is still somewhat struggling to gain commercial traction and find its place on the market.

Hioki E.E. Corporation announced the launch of the Thermistor Module U8557 and the Wireless Thermistor Module LR8537 for the LR8450 and LR8450-01 Data Logger Series. Designed for fast, high-density temperature measurement, these new modules enable EV, industrial, and energy sector engineers to capture multi-channel thermal behavior with a 50 ms data update interval, helping streamline evaluation from prototype development to validation and inspection.

Keysight Technologies, launched its next-generation Infiniium XR8 Real-Time oscilloscopes, designed to accelerate high-speed digital and compliance testing while improving efficiency and insight for modern electronics development.

Rohde & Schwarz expands its portfolio of mid-range instruments with the launch of the R&S FPL1044 spectrum analyzer and a new 40 MHz real-time spectrum analysis (RTSA) option for the entire FPL family. The R&S FPL1044 is an industry first, delivering high-frequency performance up to 44 GHz at a price point previously unattainable in the market. The universal RTSA option empowers FPL users with powerful real-time analysis capabilities.

Siemens has expanded the TIA Selection Tool Cloud with the new “Electrical Designer” feature for electrical planning. This smart software is the first and only in the IEC market that includes basic electrical knowledge and standards expertise. Electrical Designer simplifies main circuit design by automatically selecting components, verifying short-circuits, sizing cables, and creating all necessary documentation.