With a new range of Power ICs and SMD transformers, RECOM enables customers to create their own discrete DC/DC isolated power supplies. The range includes transformers compatible with flyback, push-pull and full bridge drivers in the power range from 1W to 30W. These standard sub-miniature SMD transformers cover the most common input/output voltage combinations and isolation withstand voltages up to 5000VAC/min. They will withstand a peak reflow temperature of up to 250°C for up to 10s and can withstand two times reflow process.

Moore4Power (More than Moore for Disruptive Innovations in Power Electronics) is one of Europe’s most ambitious semiconductor R&D projects. Led by Infineon Technologies AG, the Chips Joint Undertaking initiative brings together large corporations, small and medium‑sized enterprises and research institutes from 15 European countries to develop the next generation of smart, efficient and sustainable power electronics. With a total project volume of €91 million and a planned three‑year runtime, Moore4Power aims to deliver breakthrough innovations that strengthen Europe’s technological sovereignty and sustainability in power electronics.

Wolfspeed has introduced two new 3.3 kV silicon carbide (SiC) power module families – including high-power half-bridge baseplate modules and scalable full-bridge baseplate-less modules in industry-standard footprints — that are purpose-built to address the rapidly approaching power constraints driven by AI data centers and the broader energy transition. Meeting this moment requires power generation, conversion, and distribution that is faster, smaller, more efficient, cost-effective, and more resilient than anything silicon alone can deliver. These new module families give engineers the tools to modernize energy infrastructure across the entire energy life cycle.

Toshiba Electronic Devices & Storage Corporation has started shipping test samples of "TW007D120E," a 1200V trench-gate SiC MOSFET primarily intended for power supply systems in next-generation AI data centers that is also suitable for use in renewable energy-related equipment.

The Semiconductor Industry Association (SIA) today announced global semiconductor sales were $298.5 billion during the first quarter of 2026, an increase of 25% compared to Q4 of 2025. Global sales were $99.5 billion during the month of March 2026, an increase of 79.2% compared to the March 2025 total of $55.5 billion and 11.5% more than sales in February 2026.

At PCIM 2026 Mersen will be presenting its expertise in electrical protection, power management and thermal solutions for a wide range of high‑power and mission‑critical applications. These include data centers, electric mobility, rail systems, high‑voltage DC installations and defense.

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, has announced that a subsidiary of Renesas has completed the acquisition of Irida Labs, a Greece-based company specializing in embedded software for AI-powered visual perception systems.

The SEMI Silicon Manufacturers Group (SMG) has reported, in its quarterly analysis of the silicon wafer industry, that worldwide silicon wafer shipments increased 13.1% year-on-year to 3,275 million square inches (MSI) from the 2,896 MSI recorded during the same quarter of 2025. Sequentially, shipments declined 4.7% quarter-over-quarter from the 3,437 MSI recorded during the fourth quarter of 2025 in line with typical seasonality.

As AI servers require higher power density and efficient PCB space utilization, power device packaging and switching characteristics become increasingly important. This whitepaper examines practical approaches using 600V SJ MOSFETs and TOLL packaging.

This paper aims to promote the integration of DC Semiconductor Circuit Breakers (SCCBs) into existing DC networks by ensuring reliability through accurate Remaining Useful Life (RUL) predictions.

This work presents a highly-integrated GaN-based monolithic bidirectional switch (MBDS) with blocking voltage beyond 1200 V.

This paper presents a highly integrated high power density design of a motor drive, utilizing integrated GaN power stages as well as novel current sensing ICs.

Vehicles that generate their own solar power could make a significant contribution to the decarbonization of the transportation sector. Findings from the European research project SolarMoves suggest that so-called Vehicle Integrated Photovoltaics (VIPV)—solar modules integrated into vehicles—can significantly reduce electricity demand and the strain on the power grid. The study found that, in the best-case scenario, a passenger car in Central Europe can generate up to 55 percent of its annual energy needs on its own; in Southern Europe, this figure can reach up to 80 percent.

Alpha and Omega Semiconductor Limited (AOS) a supplier of a broad range of discrete power devices, wide bandgap power devices, power management ICs, and modules, has announced a new family of digital multiphase controllers: the AOZ71049QI, AOZ71149QI and AOZ71146QI. Specifically engineered for Intel IMVP9.3 Vcore power delivery, these 4-rail controllers—when paired with AOS’s benchmark DrMOS and Smart Power Stage (SPS) technology—provide a complete power solution for the latest Intel Panther Lake and Wildcat Lake mobile processor architectures.

Inductors play a critical role in power electronics, controlling current surges and serving as magnetic energy storage devices to manage, convert, and filter power. A poorly functioning inductor might result in overheating, poor voltage regulation, abnormal values, and even failure of power semiconductor devices. The article answers the question of “how to test an inductor?”

Power engineering is undergoing a fundamental transformation driven by the integration of renewable energies and the need for efficient long‑distance power transmission. This article shows how Power‑over‑Fiber (PoF) provides true galvanic isolation and reliable auxiliary power for SSTs and HVDC breakers.

Hioki E.E. Corporation announced the launch of the Thermistor Module U8557 and the Wireless Thermistor Module LR8537 for the LR8450 and LR8450-01 Data Logger Series. Designed for fast, high-density temperature measurement, these new modules enable EV, industrial, and energy sector engineers to capture multi-channel thermal behavior with a 50 ms data update interval, helping streamline evaluation from prototype development to validation and inspection.

Keysight Technologies, launched its next-generation Infiniium XR8 Real-Time oscilloscopes, designed to accelerate high-speed digital and compliance testing while improving efficiency and insight for modern electronics development.

Rohde & Schwarz expands its portfolio of mid-range instruments with the launch of the R&S FPL1044 spectrum analyzer and a new 40 MHz real-time spectrum analysis (RTSA) option for the entire FPL family. The R&S FPL1044 is an industry first, delivering high-frequency performance up to 44 GHz at a price point previously unattainable in the market. The universal RTSA option empowers FPL users with powerful real-time analysis capabilities.

Siemens has expanded the TIA Selection Tool Cloud with the new “Electrical Designer” feature for electrical planning. This smart software is the first and only in the IEC market that includes basic electrical knowledge and standards expertise. Electrical Designer simplifies main circuit design by automatically selecting components, verifying short-circuits, sizing cables, and creating all necessary documentation.